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Residue Removal

Dynasolve 219 Cured Silicone Materials Remover Dynasolve™ 219 Cured Silicone Materials Remover is used for dissolving cured silicone materials and was developed for situations in which a better penetrating solvent is required due to a smaller exposed surface area. The very low surface tension of this product allows for penetration and removal of silicone in temporary bonding applications.

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PUR-FLUSH 100 and 200 Uncured Urethane Flushing Solvents PUR-FLUSH 100 and 200 Uncured Urethane Flushing Solvents are formulated solvents that were developed for use in flushing uncured urethane from various types of polyurethane processing equipment. The unique chemistry of this product provides for a high flash point that does not leave excess residue behind after flushing.

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BPS-169 BPS-169 positive photoresist remover is an organic solvent blend which is particularly effective in removing severely processed photoresist films and etch residue over corrosion sensitive metals and alloys.

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BPS-100 BPS-100 aluminum oxide remover is a fluoride‐containing chemistry specially formulated for removal of organic and highly chemistry specially formulated for removal of organic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces.

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BPS-170 BPS-170 aqueous copper oxide remover reduces contact resistance during probe/test, reduces the oxide thickness on aged flip chip bumps, and serves as a replacement for copper and aluminum microetch in various copper/aluminum processes. This product removes oxide from bumps, bond pads, metal contacts and other interconnect layers.

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BPS-729A BPS-729A is a surfactant‐formulated low‐resistivity dicing solution has been specially formulated for high conductivity dicing applications such as ESD‐sensitive CMOS and image sensors, without the need for CO2 sparging. During the dicing process, this product is also capable of preventing galvanic corrosion and removing metal oxides off bond pads without damaging metals, silicon, passivation, polyimides and photoresists. This results in…

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BPS-729B BPS-729B surfactant‐formulated dicing solution is used as an additive to DIW during the dicing process for high‐performance adherence of silicon particles and swarf (saw residue) on Al and Cu substrates, this product can also remove oxidation from bond pads. Because of the very low etch rate on various base materials, these substrates are not affected.

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