Deuterium VLSI Deuterium VLSI (99.999%) is a high purity grade for semiconductor and optical fiber applications. Deuterium (D2) is a colorless, odorless, flammable, compressed gas.
UR-Away FL UR-Away FL is a formulated solvent for the sprayfoam industry. It used for flushing and removal of uncured urethane materials, including polyurethane foams, reactive hot melts, and other urethane-based materials.
Dynasolve FS8320 Semiaqueous Flux Remover for Wafer Level Packaging Dynasolve FS8320 is a semiaqueous defluxer designed to be effective at the removal of baked-on solvent-based flux residues. It is an excellent choice for removal of flux residues from wafers after the bumping process. Dynasolve FS8320 is exceptionally safe on all solder types including lead-free, high-lead, and eutectic. It can also be used for removal of misprinted photoresists.
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Dynasolve CU-7 Cured Polyimide Cleaning Solvent Dynasolve CU-7 is a formulated solvent used to remove cured polyimide materials. It is used in both industrial and electronic applications. It is also used extensively in the fiber optics industry.
GASGUARD® BULKGUARD™ Bulk Gases System Versum Materials' new bulk gases system - GASGUARD® BULKGUARD™ Bulk Gases System delivers maximum safety and reliability (100% uptime), lower cost of ownership, compatibility with many gases and flexible sources, flow rate scalability up to 1000 slpm and other advantages. It delivers state-of-the-art fabwide heat sourcing and control of electronic specialty gases requiring heating before delivery to the tool. Versum…
Dynastrip™ DL88 Multipurpose Photoresist Remover Dynastrip DL88 is a uniquely formulated photoresist removal product designed specifically for wafer level packaging (WLP) applications including flip-chip bumping, redistribution, and wafer level CSP.
Flipstrip Multipurpose Photoresist Remover FlipStrip is a uniquely formulated chemistry designed specifically for the removal of processed photoresists used in flip-chip bumping applications. It is effective in both electroplated solder and in-situ paste processes.
Dynastrip™ AP7900A Multipurpose Photoresist Remover Dynastrip AP7900A is a uniquely formulated photoresist remover designed specifically for stripping thick photoresist used in wafer level packaging (WLP) applications including lead-free solder bumping, µ-bumping, and Cu pillar processes
Dynastrip™ 7700 Multipurpose Photoresist Remover Dynastrip 7700 is a uniquely formulated photoresist remover designed specifically for removing thick resist (dry film or liquid) used in wafer level packaging (WLP) including lead-free solder bumping, m-bumping and Cu pillar processes.