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Dynasolve FS8320 Semiaqueous Flux Remover for Wafer Level PackagingDynasolve FS8320 is a semiaqueous defluxer designed to be effective at the removal of baked-on solvent-based flux residues. It is an excellent choice for removal of flux residues from wafers after the bumping process. Dynasolve FS8320 is exceptionally safe on all solder types including lead-free, high-lead, and eutectic. It can also be used for removal of misprinted photoresists.  

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Versum Materials – Delivery Systems & ServicesNo. 238 Fenju Road China (Shanghai) Pilot Free Trade Zone Shanghai, 200131

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Dynasolve CU-7 Cured Polyimide Cleaning SolventDynasolve CU-7 is a formulated solvent used to remove cured polyimide materials. It is used in both industrial and electronic applications. It is also used extensively in the fiber optics industry.

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GASGUARD® BULKGUARD™ Bulk Gases SystemVersum Materials' new bulk gases system - GASGUARD® BULKGUARD™ Bulk Gases System delivers maximum safety and reliability (100% uptime), lower cost of ownership, compatibility with many gases and flexible sources, flow rate scalability up to 1000 slpm and other advantages. It delivers state-of-the-art fabwide heat sourcing and control of electronic specialty gases requiring heating before delivery to the tool. Versum…

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Dynastrip™ DL88 Multipurpose Photoresist RemoverDynastrip DL88 is a uniquely formulated photoresist removal product designed specifically for wafer level packaging (WLP) applications including flip-chip bumping, redistribution, and wafer level CSP.

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Flipstrip Multipurpose Photoresist RemoverFlipStrip is a uniquely formulated chemistry designed specifically for the removal of processed photoresists used in flip-chip bumping applications. It is effective in both electroplated solder and in-situ paste processes.

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Dynastrip™ AP7900A Multipurpose Photoresist RemoverDynastrip AP7900A is a uniquely formulated photoresist remover designed specifically for stripping thick photoresist used in wafer level packaging (WLP) applications including lead-free solder bumping, µ-bumping, and Cu pillar processes

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Dynastrip™ 7700 Multipurpose Photoresist RemoverDynastrip 7700 is a uniquely formulated photoresist remover designed specifically for removing thick resist (dry film or liquid) used in wafer level packaging (WLP) including lead-free solder bumping, m-bumping and Cu pillar processes.

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GASGUARD® BULK eV Temperature Control System for Y-CylindersThe latest generation of smart manufacturing technology for heated gases – lowers cost of ownership, delivers higher flows, further enhances safety and reliability. The self-contained GASGUARD Bulk eV Temperature Control System for heating Y-Cylinders is being made available in two phases: First the ECC controller and, second, the new blanket. Modification is possible so that the system could also accommodate…

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GASGUARD® Active Control Phase 1Maintain, repeat and stabilize pressure for high vapor pressure gases under varying manufacturing conditions with zero drift. Our GASGUARD Active Phase I technology now allows semiconductor fabs to achieve much greater precision in controlling the pressure of high vapor pressure gases such as dopant gases, purge gases and high-pressure halocarbons (NF3, silane, N2O, CO2, CF4, etc.) during delivery to the…

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