Dynasolve FS8320 Semiaqueous Flux Remover for Wafer Level PackagingDynasolve FS8320 is a semiaqueous defluxer designed to be effective at the removal of baked-on solvent-based flux residues. It is an excellent choice for removal of flux residues from wafers after the bumping process. Dynasolve FS8320 is exceptionally safe on all solder types including lead-free, high-lead, and eutectic. It can also be used for removal of misprinted photoresists.
Dynasolve CU-7 Cured Polyimide Cleaning SolventDynasolve CU-7 is a formulated solvent used to remove cured polyimide materials. It is used in both industrial and electronic applications. It is also used extensively in the fiber optics industry.
GASGUARD® AP11 Controller Auto Recovery/Auto RestartThe Auto Recovery System’s (ARS) main objective is to maintain safe gas delivery in an unexpected event. Keep process gas systems operating or returned to original settings; will not override safety alarms. The GASGUARD AP11 is the only commercially available controller that has a second microprocessor as standard equipment for the ARS benefit.
Dynastrip™ DL88 Multipurpose Photoresist RemoverDynastrip DL88 is a uniquely formulated photoresist removal product designed specifically for wafer level packaging (WLP) applications including flip-chip bumping, redistribution, and wafer level CSP.
Flipstrip Multipurpose Photoresist RemoverFlipStrip is a uniquely formulated chemistry designed specifically for the removal of processed photoresists used in flip-chip bumping applications. It is effective in both electroplated solder and in-situ paste processes.
Dynastrip™ AP7900A Multipurpose Photoresist RemoverDynastrip AP7900A is a uniquely formulated photoresist remover designed specifically for stripping thick photoresist used in wafer level packaging (WLP) applications including lead-free solder bumping, µ-bumping, and Cu pillar processes
Dynastrip™ 7700 Multipurpose Photoresist RemoverDynastrip 7700 is a uniquely formulated photoresist remover designed specifically for removing thick resist (dry film or liquid) used in wafer level packaging (WLP) including lead-free solder bumping, m-bumping and Cu pillar processes.
S-1088 Exhausted Line Rinse StationThe Versum Materials Model S-1088 is a self-contained, fully automatic system designed to clean stainless steel exhaust lines, and other FAB parts with a user programmable DIW and acid blend.
S-1702 Etch Parts CleanerThe Versum Materials Model S-1702 is a self-contained, fully automatic system designed to acid etch and rinse quartz chambers, ceramic rings, shower heads and miscellaneous parts, using precise pre-programmed recipes. USER selectable acid spray and spray rinse cycles delivering uniform etching and complete rinsing.
S-1087 Exhausted Work StationThe Versum Materials S-1087 Exhausted Work Station is a self-contained, manual work station is designed to perform part cleans and rinses in an exhausted environment. The sink is fitted with two (2) fixed sprays bars, which can be operated by pushing the “spray bar on” button. A pneumatically operated drain valve will allow the operator to fill or dump the…