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BPS-169 BPS-169 positive photoresist remover is an organic solvent blend which is particularly effective in removing severely processed photoresist films and etch residue over corrosion sensitive metals and alloys.

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CHEMGUARD® 1000-2000 Automated Chemical Refill Systems Our CHEMGUARD 1000 and 2000 models are single tank liquid refill systems (STLRs) designed to work with quartz host ampoules and Source Controller Modules (SCMs) to provide 100% tool uptime. Years of experience goes into all of our high purity chemical delivery equipment, ensuring delivery of ultra high purity (UHP) liquids in a safe and cost-efficient manner. CHEMGUARD 1000 and…

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BPS-100 BPS-100 aluminum oxide remover is a fluoride‐containing chemistry specially formulated for removal of organic and highly chemistry specially formulated for removal of organic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces.

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BPS-106 BPS-106 oxidation and organics remover for IC assembly and packaging is a formulated semiaqueous product optimized for cleaning of Aluminum surfaces to enhance wirebond‐related process and device reliability. A superior alternative to Ar/O2 plasma, this product reduces contamination from oxide, organics, solder flux and halogen residuals such as chlorine on bond pads. Specially tuned for cleaning of and compatibility with…

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BPS-170 BPS-170 aqueous copper oxide remover reduces contact resistance during probe/test, reduces the oxide thickness on aged flip chip bumps, and serves as a replacement for copper and aluminum microetch in various copper/aluminum processes. This product removes oxide from bumps, bond pads, metal contacts and other interconnect layers.

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BPS-600 Optimized for Aluminum and Copper Metals, BPS-600 is a formulated semi-aqueous for cleaning of Aluminum and Copper bond pad wafers to enhance wirebond-related process/device reliability.

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BPS-729A BPS-729A is a surfactant‐formulated low‐resistivity dicing solution has been specially formulated for high conductivity dicing applications such as ESD‐sensitive CMOS and image sensors, without the need for CO2 sparging. During the dicing process, this product is also capable of preventing galvanic corrosion and removing metal oxides off bond pads without damaging metals, silicon, passivation, polyimides and photoresists. This results in…

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BPS-729B BPS-729B surfactant‐formulated dicing solution is used as an additive to DIW during the dicing process for high‐performance adherence of silicon particles and swarf (saw residue) on Al and Cu substrates, this product can also remove oxidation from bond pads. Because of the very low etch rate on various base materials, these substrates are not affected.

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Antimony Precursors Versum Materials offers a series of advanced Germanium (Ge), Antimony (Sb) and Tellurium (Te) precursors for Thin Film Deposition of phase changing alloys such as GST. These precursors are volatile liquids which are suitable for direct evaporation at modest temperatures.

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ACT CMIK-S ACT® CMIK-S positive photoresist stripper is a proprietary formulation specifically designed for effective positive photoresist stripping and residue removal from highly corrosion-sensitive metals and metal alloy substrates. Solvent-based, this product can be used for aluminum and advanced packaging applications.

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