Dynasolve FS8320 Semiaqueous Flux Remover for Wafer Level Packaging Dynasolve™ FS8320 Semiaqueous Flux Remover for Wafer Level Packaging is designed to be effective at the removal of baked-on solvent-based flux residues. It is an excellent choice for removal of flux residues from wafers after the bumping process. Dynasolve FS8320 is exceptionally safe on all solder types including lead-free, high-lead, and eutectic. It can also be used for removal of…
Dynasolve CU-7 Cured Polyimide Cleaning Solvent Dynasolve™ CU-7 Cured Polyimide Cleaning Solvent is a formulated solvent used to remove cured polyimide materials. It is used in both industrial and electronic applications. It is also used extensively in the fiber optics industry.
Dynasolve 219 Cured Silicone Materials Remover Dynasolve™ 219 Cured Silicone Materials Remover is used for dissolving cured silicone materials and was developed for situations in which a better penetrating solvent is required due to a smaller exposed surface area. The very low surface tension of this product allows for penetration and removal of silicone in temporary bonding applications.
Dynasolve Mold Cleaner 1000 Urethane Mold Cleaning Solvent Dynasolve Mold Cleaner 1000 Urethane Mold Cleaning Solvent is a formulated cleaning solvent that is used in the urethane molding industry for removing cured urethane from tooling but leaves behind the layer of silicone-based release agent.
Dynasolve CU-9 Cured Urethane Cleaning Solvent Dynasolve™ CU-9 Cured Urethane Cleaning Solvent is a formulated solvent used to remove the buildup of silicone release agent and cured urethane from urethane molds and tools.
Dynasolve ISO-Neutralizer Liquid Isocyanate Cleaning Solvent Dynasolve™ ISO-Neutralizer Liquid Isocyanate Cleaning Solvent is a companion product to Dynaloy's urethane cleaning solvents. It is used to remove any excess liquid isocyanate from urethane-processing equipment prior to cleaning the system with Dynaloy CU-6
Dynaloy 536 Low-cost Epoxy Silver/Copper Solder Dynaloy™ 536 Low-cost Epoxy Silver/Copper Solder is a two component, room-temperature cure, silver coated, copper filled epoxy with excellent adhesive properties and good conductivity. The passivated copper is unreactive in the organic vehicle and thereby exhibits good storage stability. It is also highly stable in the applied film ensuring that the good conductivity of the coating is maintained during service.
Dynasolve 699 Cured Acrylic Cleaning Solvent Dynasolve™ 699 Cured Acrylic Cleaning Solvent is a formulated solvent used to remove acrylic and methacrylate materials in both electronic and industrial applications.
Dynasolve 700 Series – 711, 715, 750, 760 Cured Polymer Cleaning Solvents The Dynasolve™ 700 Series solvents are reactive formulated solvents that are used to remove anhydride-cured epoxy, urethane, and silicone. The solvents are used in both industrial and electronic applications. The four products differ in terms of aluminum capability, the presence or not of the solvent NMP, and REACH compliance (refer to the datasheet for more information).
Dynaloy 335 Silver Epoxy Adhesive Dynaloy™ 335 Silver Epoxy Adhesive is a two component pure silver filled epoxy, which combines the excellent adhesive properties of epoxy with the electrical conductivity of pure silver.